FC820 System Mainly used to clean flux residual and solder balls on FC/SiP chips after soldering. The system adopts SUS304 flat net conveyor transportation system; high pressure and high flow upper and lower spray cleaning process to wash,rinse and dry Chips(substrate) automatically.
Put in SIP modulars → water vapor isolation → chemical liquid wash1 → chemical liquid wash2 →chemical liquid wash3→ chemical isolation → DI water pre-rinse → DI water rinse1 →DI wateer rinse2→ DI water final rinse → Air blow → hot air dry 1 → hot air dry 2 → send out SIP modulars
- Wash1 section: Soften and decrease the biscosity of flux or dusts.
- Wash2&3 section:Wash flux and dusts particles on Chip(substrate).
- Chemical isolation section: Isolation liquid between wash and DI water pre-rinse section.
- Pre-rinse section: DI water rinse flux and liquid on Chip(substrate).
- Rinse1&2 section: Further rinse flux and ion contamination on Chip(substrate).
- Final rinse section: remove rinse ion contamination on Chip(substrate).
- Air blow section: Blow off DI water residual on Chip(substrate).
- Hot air dry section: Hot air blow to toast moisture on Chip(substrate).
Guangdong Advance Spray Cleaning Technology Co., Ltd.
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